Semiconductor & Electronics
Industry Requirements
Precision components for semiconductor production equipment, high-end electronic components, integrated heat dissipation assemblies, and industrial vacuum seals demand ultra-high processing cleanliness, dimensional accuracy and mechanical performance. All oxidation, impurity contamination and surface defects must be eliminated. Heat treatment is conducted in a high-cleanliness, oxygen-free environment with strictly controlled temperature deviations, meeting the high-precision, high-cleanliness and high-stability manufacturing specifications of the electronics industry and complying with SEMI standards.
Applicable Workpieces
Precision components for semiconductor equipment (vacuum chambers, wafer fixtures), high-end precision electronic components, integrated heat dissipation assemblies, industrial vacuum seals, electronic connectors, precision electronic hardware parts, semiconductor packaging molds, and other core electronic precision parts.
Custom Solutions
We adopt high-cleanliness vacuum heat treatment furnaces, vacuum degassing furnaces and vacuum brazing furnaces as core equipment, paired with dust-free processing environments and precision temperature control systems to deliver eco-friendly and high-precision processes, including high-temperature vacuum degassing, low-temperature precision annealing, clean oxidation-free brazing, and precision quenching and tempering. The entire processing procedure maintains a dust-free and contamination-free environment with a temperature control accuracy of ±0.5°C and controllable dimensional precision. It effectively avoids defects such as oxidation, decarburization and surface scratches, fully conforming to the high-precision, high-cleanliness and high-stability manufacturing standards of the electronic manufacturing industry, and perfectly adapting to the processing requirements of high-end products in the semiconductor and electronics sectors.
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